(TOSHIBA)东芝光耦:DIP8(LF1)封装
2022-04-30 13:52分类:电子元器件 阅读:
SpecificaTIon of DIP8(LF1) package
Toshiba Code |
11-10C401
MounTIng |
Surface Mount
Pins |
8
Weight (typ.) |
0.54 g
Packing Method |
Magazine, Embossed Tape
Minimum QuanTIty |
50 pcs/Magazine, 1500 pcs/Reel
Packing Name |
TP1
Tape Width (mm) |
16
Package Dimensions (mm)
/
Land Pattern Example (mm) |
MagazineDimensions (mm) |
Thickness: 0.5 mm
A: Magazine, B: Stopper
Tape Dimensions (mm)
/
Reel Dimensions (mm) |
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