(TOSHIBA)东芝光耦:SO6封装(包装)
2022-05-04 15:04分类:电子元器件 阅读:
SpecificaTIon of SO6 package
Toshiba Code |
11-4L1
MounTIng |
Surface Mount
Pins |
5
Weight (typ.) |
0.09 g
Packing Method |
Embossed Tape
Minimum QuanTIty |
3000 pcs/Reel
Packing Name |
TPL, TPR
Tape Width (mm) |
12
Package Dimensions (mm)
/
Land Pattern Example (mm) |
Tape Dimensions (mm)
/
Reel Dimensions (mm) |
TPL
TPR
上一篇:东芝光耦:2.54 SOP4封装
下一篇:电容的计算公式,电容与电池容量的关系
相关推荐
返回顶部