pcb线路板(PCB)步骤专业术语中英文互译

步骤介绍：切料－－打孔－－湿膜制造－－压合－－减铜－－电镀工艺－－塞孔－－防焊(绿漆/绿油)

－－电镀金－－喷锡－－成形－－开短路故障检测－－全检－－镭射打孔

A. 切料( Cut LaminaTIon)

a-1 裁料( Sheets CutTIng)

a-2 原原材料发料(Panel)(Shear material to Size)

B. 打孔(Drilling)

b-1 内钻(Inner Layer Drilling )

b-2 一次孔(Outer Layer Drilling )

b-3 二次孔(2nd Drilling)

b-4 镭射打孔(Laser Drilling )(Laser AblaTIon )

b-5 盲(埋)孔打孔(Blind & Buried Hole Drilling)

C. 湿膜制造( Photo Process(D/F))

c-1 前解决(Pretreatment)

c-2 压模(Dry Film LaminaTIon)

c-3 曝出(Exposure)

c-4 显影液(Developing)

c-5 蚀铜(Etching)

c-6 去膜(Stripping)

c-7 复检( Touch-up)

c-8 有机化学前解决,有机化学碾磨( Chemical Milling )

c-9 可选择性浸金压模(Selective Gold Dry Film Lamination)

c-10 显影液(Developing )

c-11 去膜(Stripping )

Developing , Etching & Stripping ( DES )

D. 压合Lamination

d-1 变坏(Black Oxide Treatment)

d-2 微蚀(Microetching)

d-3 螺栓组成(eyelet )

d-4 叠板(Lay up)

d-5 压合(Lamination)

d-6 后处理工艺(Post Treatment)

d-7 黑空气氧化( Black Oxide Removal )

d-8 铣靶(spot face)

d-9 去漏胶(resin flush removal)

E. 减铜(Copper Reduction)

e-1 薄化铜(Copper Reduction)

F. 电镀工艺(Horizontal Electrolytic Plating)

f-1 水准电镀工艺(Horizontal Electro-Plating) (Panel Plating)

f-2 锡铅电镀工艺( Tin-Lead Plating ) (Pattern Plating)

f-3 小于1 mil ( Less than 1 mil Thickness )

f-4 高过1 mil ( More than 1 mil Thickness)

f-5 砂布碾磨(Belt Sanding)

f-6 剥锡铅( Tin-Lead Stripping)

f-7 微切成片( Microsection)

G. 塞孔(Plug Hole)

g-1 包装印刷( Ink Print )

g-2 预烤(Precure)

g-3 表层刷磨(Scrub)

g-4 后烤制(Postcure)

H. 防焊(绿漆/绿油): (Solder Mask)

h-1 C面包装印刷(Printing Top Side)

h-2 S面包装印刷(Printing Bottom Side)

h-3 静电粉末喷涂(Spray Coating)

h-4 前解决(Pretreatment)

h-5 预烤(Precure)

h-6 曝出(Exposure)

h-7 显影液(Develop)

h-8 后烤制(Postcure)

h-9 UV烤制(UV Cure)

h-10 文本包装印刷( Printing of Legend )

h-11 喷砂处理( Pumice)(Wet Blasting)

h-12 印可脱离防焊(Peelable Solder Mask)

I . 电镀金Gold plating

i-1 火红金手指电镀镍金( Gold Finger )

i-2 电镀工艺软金(Soft Ni/Au Plating)

i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)

J. 喷锡(Hot Air Solder Leveling)

j-1 水准喷锡(Horizontal Hot Air Solder Leveling)

j-2 竖直喷锡( Vertical Hot Air Solder Leveling)

j-3 非常焊锡丝(Super Solder )

j-4. 印焊锡丝突点(Solder Bump)

K. 成形(Profile)(Form)

k-1 捞型(N/C Routing ) (Milling)

k-2 模貝冲(Punch)

k-3 表面清理烤制(Cleaning & Backing)

k-4 V型槽( V-Cut)(V-Scoring)

k-5 火红金手指圆弧( Beveling of G/F)

L. 开短路故障检测(Electrical Testing) (Continuity & Insulation Testing)

l-1 AOI 电子光学查验( AOI Inspection)

l-2 VRS 目检(Verified & Repaired)

l-3 泛用型夹具检测(Universal Tester)

l-4 专用型夹具检测(Dedicated Tester)

l-5 镭射激光检测(Flying Probe)

M. 全检( Final Visual Inspection)

m-1 销钉翘( Warpage Remove)

m-2 X-OUT 包装印刷(X-Out Marking)

m-3 包裝及交货(Packing & shipping)

m-4 目检( Visual Inspection)

m-5 清理及烤制( Final Clean & Baking)

m-6 护铜剂(ENTEK Cu-106A)(OSP)

m-7 正离子残留量检测(Ionic Contamination Test )(Cleanliness Test)

m-8 热冷冲击试验(Thermal cycling Testing)

m-9 焊锡丝性实验( Solderability Testing )

N. 镭射打孔(Laser Ablation)

N-1 镭射钻Tooling孔(Laser ablation Tooling Hole)

N-2 镭射曝出对合孔(Laser Ablation Registration Hole)

N-3 镭射Mask制做(Laser Mask)

N-4 镭射打孔(Laser Ablation)

N-5 AOI 查验及VRS ( AOI Inspection & Verified & Repaired)

N-6 Blaser AOI (after Desmear and Microetching)

N-7 去胶渣(Desmear)

N-8 微蚀(Microetching )

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